Solid-state cooling chip based on piezoelectric MEMS: is it expected to subvert the traditional fan cooling method?

Also, depending on the laptop product, the AirJet cooling chip solution promises to produce only about 21 to 24 decibels of noise, softer than a whisper. Most importantly, the module based on the AirJet cooling chip is only about 2.8 mm thick, and it is not placed directly on the processor of the notebook computer, but placed on the copper pipe, so that a thinner notebook computer design can be realized. 

The AirJet cooling chip is designed to solve the cooling problem that limits CPU performance in today's notebook computers. It is a so-called "solid-state cooling solution" that completely abandons the traditional cooling method of fans. Frore Systems said: "The inside of the AirJet is a tiny piezoelectric film made using MEMS technology that vibrates at ultrasonic frequencies, and then these piezoelectric films generate a strong airflow, allowing cold air to enter the AirJet cooling chip through the top vents and flow from the sides. The heat generated by the processor is removed by the air vents. A single air particle can fly past the cooling chip at a speed of 200 kilometers per hour."

Frore Systems is currently supported by mainstream manufacturers such as Intel, GiS, and Qualcomm. Intel also plans to use AirJet cooling chip solutions in future Evo standard notebook computers.

Reprinted from www.eet-china.com