Active liquid cooling technology of piezoelectric ceramic micropump

The one-plus 11 concept version is the first product to miniaturize liquid cooling and heat dissipation technology and put it into mobile phones. There are piezoelectric ceramic micropumps and self-developed multilayer diaphragm structures inside, claiming more than 30 related patents.

The piezoelectric ceramic micropump technology is the heart of the active liquid cooling heat dissipation technology of the micropump. The overall size is 1/20 of the traditional impeller pump in the industry, and it has more than twice the driving force of the same size impeller pump.

The self-developed multilayer membrane structure uses a new ultra-thin shell sealing and packaging process, which is the first time to realize the welding and sealing of the ultra-thin membrane shell less than 0.038 mm, claiming that the enhanced water vapor barrier effect is thinner.

 One-plus claims that through this technology, under heavy load scenarios such as Genshin Impact, the temperature of the battery cover can be reduced by up to 3-4 ° C, and the frame rate stability can be improved by more than 4 frames. In addition, Active CryoFlux can also reduce the phone's temperature by 1.6 ℃ during charging, thus reducing the charging time by about 30 seconds to 45 seconds.

Reprinted from ZOL